Master Bond meets NASA specifications
10 August 2016
The EP3HTS-LO, a single component epoxy for demanding bonding, sealing and coating applications from Master Bond, has passed ASTM E595 tests for NASA low outgassing.
Ideal for use in the aerospace, electronic, microelectronic and optical industries, Master Bond says its EP3HTS-LO features a silver filler and is electrically conductive with a low volume resistivity of less than 0.001 ohm-cm. It also has a thermal conductivity of 12-15 BTU•in/(ft²•hr•°F) [1.73-2.16 W/(mK)].
EP3HTS is dimensionally stable and bonds well to metals, glass, composites, ceramics and many plastics. It withstands a variety of chemicals such as water, oils, fuels and cleaning agents. This high temperature resistant system is serviceable over the wide temperature range of -51°C to +204°C.
As a one part compound, EP3HTS-LO offers convenient handling with no mixing and an unlimited working life at room temperature. This smooth thixotropic paste can be readily dispensed from a syringe. It polymerises quickly at elevated temperatures with cure schedules of 45 – 50 minutes at 121°C or 20 – 30 minutes at 148°C.
EP3HTS-LO is available for use in glass jars and syringes. It has a minimum shelf life of 3 months and a maximum of 6 months at ambient temperatures in its original, unopened containers.