Fast-curing, jet-dispensed SMD adhesive 10 November 2023

At October’s BondExpo fair in Stuttgart, Germany, Panacol will be introducing its new, extremely fast-curing adhesive, Structalit® 5604, which has been specifically developed for bonding surface mounted devices (SMDs) to printed circuit boards.

The new red coloured adhesive is a one component epoxy resin that contrasts well with green PCB material – making it possible to ensure visual in-line inspection and, despite its high viscosity, it is also suitable for jet application. It can, therefore, be dispensed in production through jetting, as well as valve dispensing or screen printing. In fact, its ideally adjusted viscosity and high thixotropy index enable high-speed dispensing, precise dot profiles, and non-slumping wet adhesion prior to curing, which takes place with heat. The thermal cure actually occurs within minutes, even at low temperatures. When fully cured, the adhesive is extremely temperature resistant, it can withstand short-term temperatures of up to 270°C – making it suitable for reflow soldering processes.

The new Structalit 5604 is also particularly shock resistant and durable, adhering to FR4 printed circuit boards, metals and epoxy-based moulded materials. Due to its high glass transition range of >115°C, the adhesive is ideal for electronic component assembly. It does not lose adhesion or soften at elevated temperatures. As it was developed specifically for use in electronics, the adhesive has high ionic purity and thus provides optimum protection against internal corrosion. 

Panacol will be at the BondExpo fair in Stuttgart, Germany, in hall 5, stand 5417, from 10th – 13th October 2023.  

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Will joined Fastener + Fixing Magazine in 2007 and over the last 15 years has experienced every facet of the fastener sector - interviewing key figures within the industry and visiting leading companies and exhibitions around the globe.

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