Dymax Corporation, a manufacturer of rapid light curing materials and equipment, has introduced its Low Shrink™ OP-81-LS epoxy that cures in seconds upon exposure to broad spectrum light for fast, precise optical assembly.
OP-81-LS has a variety of features including very low volumetric shrinkage during cure; low CTE for stability through thermal excursions; as well as meeting ASTM E595 outgassing requirements – making it ideal for the positioning and bonding of lenses, prisms, fibres or other optical components. The material doesn’t react until exposed to light, so manufacturers have time to accurately align parts before assembly and cure.
The epoxy also features a low temperature heat curing function of 80°C – 85°C in applications where shadow areas exist or where heat cure only is preferred. The material is solvent-free and one component, requiring no mixing. Low Shrink OP-81-LS is designed to bond dissimilar substrates, including polycarbonate, glass, acrylic, and metallic surfaces, making it well suited for use in consumer electronics applications.
Biog
Having spent a decade in the fastener industry experiencing every facet – from steel mills, fastener manufacturers, wholesalers, distributors, as well as machinery builders and plating + coating companies, Claire has developed an in-depth knowledge of all things fasteners.
Alongside visiting numerous companies, exhibitions and conferences around the world, Claire has also interviewed high profile figures – focusing on key topics impacting the sector and making sure readers stay up to date with the latest developments within the industry.
